Invention Grant
US09401691B2 Acoustic resonator device with air-ring and temperature compensating layer
有权
具有空气环和温度补偿层的声谐振器装置
- Patent Title: Acoustic resonator device with air-ring and temperature compensating layer
- Patent Title (中): 具有空气环和温度补偿层的声谐振器装置
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Application No.: US14266445Application Date: 2014-04-30
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Publication No.: US09401691B2Publication Date: 2016-07-26
- Inventor: Qiang Zou , Chris Feng , Phil Nikkel , John Choy , Alexandre Augusto Shirakawa , Tina L. Lamers , Sook Ching Chang , Dariusz Burak
- Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H3/013 ; H03H9/17 ; H03H9/13

Abstract:
A bulk acoustic wave (BAW) resonator device includes a substrate defining a cavity, a bottom electrode formed over the substrate and at least a portion of the cavity, a piezoelectric layer formed on the bottom electrode, and a top electrode formed on the piezoelectric layer. An air-wing and an air-bridge are formed between the piezoelectric layer and the top electrode, the air-wing having an inner edge that defines an outer boundary of an active region of the BAW resonator device. The BAW resonator device further includes a temperature compensation feature having positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric layer. The temperature compensation feature extends outside the active region by a predetermined length.
Public/Granted literature
- US20150318837A1 ACOUSTIC RESONATOR DEVICE WITH AIR-RING AND TEMPERATURE COMPENSATING LAYER Public/Granted day:2015-11-05
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