Invention Grant
US09402310B2 Low-dielectric resin composition and copper-clad laminate and printed circuit board using the same
有权
低介电树脂组合物和覆铜层压板及使用其的印刷电路板
- Patent Title: Low-dielectric resin composition and copper-clad laminate and printed circuit board using the same
- Patent Title (中): 低介电树脂组合物和覆铜层压板及使用其的印刷电路板
-
Application No.: US14170263Application Date: 2014-01-31
-
Publication No.: US09402310B2Publication Date: 2016-07-26
- Inventor: Rongtao Wang , Chen Yu Hsieh , Wenjun Tian , Ziqian Ma , Wenfeng LV
- Applicant: Elite Electronic Material (KunShan) Co., Ltd.
- Applicant Address: CN Kunshan, Jiangsu Province
- Assignee: Elite Electronic Material (Kunshan) Co., Ltd.
- Current Assignee: Elite Electronic Material (Kunshan) Co., Ltd.
- Current Assignee Address: CN Kunshan, Jiangsu Province
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201310347853 20130809
- Main IPC: B32B27/00
- IPC: B32B27/00 ; H05K1/03
Abstract:
The present invention provides a resin composition useful for a copper-clad laminate and a printed circuit board, wherein the resin composition comprises the following components: (A) 100 parts by weight of vinyl-containing polyphenylene ether resin; (B) 5 to 50 parts by weight of maleimide; (C) 10 to 100 parts by weight of styrene-butadiene copolymer; and (D) 5 to 30 parts by weight of cyanate ester resin. The present invention also provides a resin composition and an article made therefrom having low dissipation factor at high frequency and excellent thermal resistance and peeling strength and being useful for a copper-clad laminate and a printed circuit board.
Public/Granted literature
- US20150044485A1 LOW-DIELECTRIC RESIN COMPOSITION AND COPPER-CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING THE SAME Public/Granted day:2015-02-12
Information query
