Invention Grant
- Patent Title: Methodology and apparatus for testing conductive adhesive within antenna assembly
- Patent Title (中): 用于测试天线组件内的导电胶的方法和装置
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Application No.: US13968166Application Date: 2013-08-15
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Publication No.: US09404842B2Publication Date: 2016-08-02
- Inventor: Joshua G. Nickel , Chun-Lung Chen , Tseng-Mau Yang , Nicholas G. Merz , Robert W. Schlub , Boon W. Shiu , Erica J. Tong
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group, P.C.
- Agent Michael H. Lyons
- Main IPC: G01N19/04
- IPC: G01N19/04 ; G01N3/56 ; H04B17/00 ; G01N3/08 ; G01N3/24 ; H04B17/16

Abstract:
Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria.
Public/Granted literature
- US20150050893A1 Methodology and Apparatus for Testing Conductive Adhesive Within Antenna Assembly Public/Granted day:2015-02-19
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