Invention Grant
US09405287B1 Apparatus and method for optical calibration of wafer placement by a robot
有权
由机器人进行晶片放置的光学校准的装置和方法
- Patent Title: Apparatus and method for optical calibration of wafer placement by a robot
- Patent Title (中): 由机器人进行晶片放置的光学校准的装置和方法
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Application No.: US14806220Application Date: 2015-07-22
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Publication No.: US09405287B1Publication Date: 2016-08-02
- Inventor: Abraham Ravid , Todd J. Egan , Eran Weiss , Michael R. Rice , Izya Kremerman
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agent Robert M. Wallace
- Main IPC: G06F7/00
- IPC: G06F7/00 ; G06F19/00 ; G05B19/19
Abstract:
An optical calibration method and apparatus for calibration of wafer positioning within a reactor chamber under process conditions employs an array of cameras in a lid of the chamber using images of the wafer edge to locate the wafer relative to the reference feature.
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