Invention Grant
- Patent Title: Ceramic electronic component
- Patent Title (中): 陶瓷电子元件
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Application No.: US14496066Application Date: 2014-09-25
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Publication No.: US09406443B2Publication Date: 2016-08-02
- Inventor: Seiji Katsuta
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2013-221785 20131025; JP2014-154882 20140730
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/232 ; H01G4/012 ; H01G4/008 ; H01G4/12

Abstract:
In a ceramic electronic component, when a distance between a first end surface and an edge of a portion of a first baked electrode layer disposed on a second principal surface in a length direction is A, a distance between the first end surface and an effective region in the length direction is B, and a distance between the first end surface and an edge of a portion of a first resin-containing electrode layer disposed on the second principal surface in the length direction is C, A
Public/Granted literature
- US20160020028A1 CERAMIC ELECTRONIC COMPONENT Public/Granted day:2016-01-21
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