发明授权
- 专利标题： Lead frame, electric power converting device, semiconductor apparatus and method of manufacturing semiconductor apparatus
- 专利标题（中）： 引线框架，电力转换装置，半导体装置及制造半导体装置的方法
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申请号： US14314485申请日： 2014-06-25
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公开(公告)号： US09406593B2公开(公告)日： 2016-08-02
- 发明人: Takuya Kadoguchi , Takahiro Hirano , Arata Harada , Masayoshi Nishihata , Tomomi Okumura
- 申请人： Takuya Kadoguchi , Takahiro Hirano , Arata Harada , Masayoshi Nishihata , Tomomi Okumura
- 申请人地址： JP Toyota-shi, Aichi-ken JP Kariya-shi, Aichi-ken
- 专利权人： Toyota Jidosha Kabushiki Kaisha,Denso Corporation
- 当前专利权人： Toyota Jidosha Kabushiki Kaisha,Denso Corporation
- 当前专利权人地址： JP Toyota-shi, Aichi-ken JP Kariya-shi, Aichi-ken
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- 优先权： JP2013-156787 20130729
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/00
摘要：
According to the disclosure, a lead frame is provided, which includes: a first island and a second island that are arranged side by side; an outer peripheral frame; first leads that extend in a second direction perpendicular to the first direction; second leads that extend in the second direction; a first coupling portion that couples the first leads to the frame; a second coupling portion that couples the second leads to the frame; an intermediate portion formed between the first and second coupling portions in the first direction such that it extends in the second direction to terminate before the space between the first and second islands; and a deformation restraining portion formed or provided in at least one of the first leads, the second leads, the first and the second coupling portions and configured to restrain deformations of the first and second leads during a molding process.