Invention Grant
- Patent Title: Electronic device and method for fabricating an electronic device
- Patent Title (中): 用于制造电子设备的电子设备和方法
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Application No.: US13282927Application Date: 2011-10-27
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Publication No.: US09406646B2Publication Date: 2016-08-02
- Inventor: Khalil Hosseini , Frank Kahlmann
- Applicant: Khalil Hosseini , Frank Kahlmann
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L23/29 ; H01L23/31 ; H01L21/56 ; H01L29/40 ; H01L23/552
Abstract:
An embodiment electronic device comprises a semiconductor chip including a first main face, a second main face and side faces each connecting the first main face to the second main face. A metal layer is disposed above the second main face and the side faces, the metal layer including a porous structure.
Public/Granted literature
- US09275973B2 Electronic device and method for fabricating an electronic device Public/Granted day:2016-03-01
Information query
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