Invention Grant
US09407311B2 Contactless signal splicing using an extremely high frequency (EHF) communication link 有权
使用极高频(EHF)通信链路进行非接触式信号拼接

Contactless signal splicing using an extremely high frequency (EHF) communication link
Abstract:
A first electronic device may include a first electronic circuit and a second electronic circuit. The first electronic device may include an internal communication link providing a signal path for conducting communication signals between the first electronic circuit and the second electronic circuit. An interface circuit may be operatively coupled to the internal communication link. The interface circuit may include an extremely high frequency (EHF) communications circuit configured to receive an EHF electromagnetic signal from another EHF communications circuit of a second electronic device. This EHF electromagnetic signal may enable the second electronic device to control or monitor the first electronic device.
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