Invention Grant
US09407311B2 Contactless signal splicing using an extremely high frequency (EHF) communication link
有权
使用极高频(EHF)通信链路进行非接触式信号拼接
- Patent Title: Contactless signal splicing using an extremely high frequency (EHF) communication link
- Patent Title (中): 使用极高频(EHF)通信链路进行非接触式信号拼接
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Application No.: US13657482Application Date: 2012-10-22
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Publication No.: US09407311B2Publication Date: 2016-08-02
- Inventor: Gary D. McCormack , Ian A. Kyles
- Applicant: Keyssa, Inc.
- Applicant Address: US CA Campbell
- Assignee: Keyssa, Inc.
- Current Assignee: Keyssa, Inc.
- Current Assignee Address: US CA Campbell
- Agency: Fenwick & West LLP
- Main IPC: H04B1/40
- IPC: H04B1/40 ; H04B5/00 ; H05K1/02

Abstract:
A first electronic device may include a first electronic circuit and a second electronic circuit. The first electronic device may include an internal communication link providing a signal path for conducting communication signals between the first electronic circuit and the second electronic circuit. An interface circuit may be operatively coupled to the internal communication link. The interface circuit may include an extremely high frequency (EHF) communications circuit configured to receive an EHF electromagnetic signal from another EHF communications circuit of a second electronic device. This EHF electromagnetic signal may enable the second electronic device to control or monitor the first electronic device.
Public/Granted literature
- US20130109303A1 CONTACTLESS SIGNAL SPLICING Public/Granted day:2013-05-02
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