An improved bus apparatus includes a generally rigid substrate and a conductor apparatus. The conductor apparatus includes a number of bus elements that are embedded within the substrate and which are electrically connected with connection elements that each have an end that is situated external to the substrate. Additional connection elements extend through the substrate and are connectable with loads. Circuit interrupters and other devices are connectable with pairs of the connector elements, wherein one connector element is connected with a line and wherein another connector element is connected with a load. The bus apparatus is formed by receiving the bus elements in channels formed in layers of a thermally conductive and electrically insulative material, and the layers are bonded together with the use of a bonding material to cause the bus elements to become laminated within the interior of the substrate.