Invention Grant
- Patent Title: Silver based conductive layer for flexible electronics
- Patent Title (中): 用于柔性电子元件的银基导电层
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Application No.: US14807336Application Date: 2015-07-23
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Publication No.: US09408303B2Publication Date: 2016-08-02
- Inventor: Mohd Fadzli Anwar Hassan , Guowen Ding , Minh Huu Le , Minh Anh Nguyen , Zhi-Wen Sun , Guizhen Zhang
- Applicant: Intermolecular Inc.
- Applicant Address: US CA San Jose
- Assignee: Intermolecular, Inc.
- Current Assignee: Intermolecular, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: B32B15/04
- IPC: B32B15/04 ; H05K1/09 ; C23C28/00 ; C23C30/00 ; H05K1/02 ; H01L51/52 ; H01L51/00

Abstract:
Coated articles are disclosed. The coated articles include a doped or alloyed silver layer sandwiched between two layers of transparent conductive oxide such as indium tin oxide (ITO). The doped silver or silver alloy layer can be thin, such as between 1. 5 to 20 nm and thus can be transparent. The doped silver or silver alloy can provide improved ductility property, allowing the conductive stack to be bendable. The transparent conductive oxide layers can also be thin, allowing the conductive stack can have improved ductility property.
Public/Granted literature
- US20150327366A1 Silver Based Conductive Layer for Flexible Electronics Public/Granted day:2015-11-12
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