Invention Grant
- Patent Title: Process and structure to uncurl embossed thin flex circuits
- Patent Title (中): 不弯曲压花薄柔性电路的工艺和结构
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Application No.: US13755631Application Date: 2013-01-31
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Publication No.: US09409343B2Publication Date: 2016-08-09
- Inventor: Bryan R. Dolan , Michael Leo
- Applicant: XEROX CORPORATION
- Applicant Address: US CT Norwalk
- Assignee: XEROX CORPORATION
- Current Assignee: XEROX CORPORATION
- Current Assignee Address: US CT Norwalk
- Agency: MH2 Technology Law Group LLP
- Main IPC: B29C53/18
- IPC: B29C53/18 ; H05K1/11 ; B29L31/34 ; H05K3/00
Abstract:
A method and structure for flattening or straightening a curled flexible printed circuit, such as a flexible printed circuit that has been curled during a contact embossing process. The structure can include a cylindrical opening and a support shaft suspended within the cylindrical opening that prevents buckling of the flexible printed circuit during straightening. To flatten the curled flexible printed circuit, the curled end of the flexible printed circuit can be inserted into the cylindrical opening until the curled end is wrapped partially or completely around the support shaft.
Public/Granted literature
- US20140210123A1 PROCESS AND STRUCTURE TO UNCURL EMBOSSED THIN FLEX CIRCUITS Public/Granted day:2014-07-31
Information query
