Invention Grant
- Patent Title: Electronic device, mounting member, and mounting method
- Patent Title (中): 电子装置,安装构件和安装方法
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Application No.: US14602492Application Date: 2015-01-22
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Publication No.: US09414508B2Publication Date: 2016-08-09
- Inventor: Herofumi Morita , Satoru Yasui , Wenhsiang Wu , Atsushi Tatemichi , Yasuyuki Suzuki , Masanobu Asano
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2014-176300 20140829
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/02

Abstract:
According to one embodiment, device includes first wall, first base, mount, module, and first and second combining portions. First base protrudes from first wall in thickness direction. First base includes first opening. Mount includes second base and second wall. Second base includes second opening toward first wall. Second wall extends from one side of second base located farther from first wall in the direction to one side of first base located farther from first wall in the direction. Second wall includes third opening which overlaps first opening. Module includes third wall and body. Third wall is located at another side of second base. Third wall includes fourth opening which overlaps second opening. Body is apart from second base. First combining portion penetrates through fourth opening and is inserted into second opening. Second combining portion penetrates through third opening and is inserted into first opening.
Public/Granted literature
- US20160066450A1 ELECTRONIC DEVICE, MOUNTING MEMBER, AND MOUNTING METHOD Public/Granted day:2016-03-03
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