- 专利标题： Thermal detachment system for implantable devices
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申请号： US11416826申请日： 2006-05-03
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公开(公告)号： US09414819B2公开(公告)日： 2016-08-16
- 发明人: Matthew Fitz , Joseph Gulachenski
- 申请人： Matthew Fitz , Joseph Gulachenski
- 申请人地址： US CA Tustin
- 专利权人： MicroVention, Inc.
- 当前专利权人： MicroVention, Inc.
- 当前专利权人地址： US CA Tustin
- 代理机构： Inskeep IP Group, Inc.
- 主分类号： A61M29/00
- IPC分类号： A61M29/00 ; A61B17/00 ; A61B17/12 ; A61F2/95
摘要：
The present invention provides for implant device delivery apparatuses and related methods of use. The delivery systems of the present invention incorporate a stretch resistant tube that advantageously makes the implant device, such as an embolic coil, stretch resistant while a delivery system is being used to position the implant device at a desired target site.
公开/授权文献
- US20060200192A1 Thermal detachment system for implantable devices 公开/授权日：2006-09-07
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