An abrasive pad used to abrade the surfaces of glass, ceramic, and metal materials, the abrasive pad being provided with a substrate layer, and an abrasive layer provided on a first surface side of the substrate layer and including an abrasive material, and the abrasive layer having a plurality of base portions arranged mutually separated on the substrate layer, columnar or frustum shaped tip portions arranged mutually separated on the base portions, and a group of grooves containing a plurality of groove portions provided between base portions such that the substrate layer is exposed, with each of the grooves mutually intersecting.