Invention Grant
- Patent Title: Temperature sensor
- Patent Title (中): 温度感应器
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Application No.: US13788473Application Date: 2013-03-07
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Publication No.: US09417135B2Publication Date: 2016-08-16
- Inventor: Yuusuke Toudou , Tsunenobu Hori , Sotoo Takahashi
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2012-049682 20120306
- Main IPC: G01K7/00
- IPC: G01K7/00 ; G01K7/16

Abstract:
The temperature sensor includes a thermo-sensitive element, first and second electrode wires electrically connected to the thermo-sensitive element, first and second signal wires partially overlapped with and connected to the first and second electrode wires, respectively. The first and second electrode wires are made of a first metal material consisting primarily of Pt. The first and second signal wires are made of a second metal material containing Al and having a linear thermal expansion coefficient larger than that of the first metal material. Each of an overlap portion of the first electrode wire and the first signal wire and an overlap portion of the second electrode wire and the second signal wire includes a junction part formed by melting and thereafter coagulating the first or second electrode wire and the first or second signal wire. The junction part includes an oxidation film containing Al formed on a surface thereof.
Public/Granted literature
- US20130235904A1 TEMPERATURE SENSOR Public/Granted day:2013-09-12
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