Invention Grant
- Patent Title: Redistribution layers for microfeature workpieces, and associated systems and methods
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Application No.: US14984354Application Date: 2015-12-30
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Publication No.: US09418970B2Publication Date: 2016-08-16
- Inventor: David Pratt
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L25/065 ; H01L25/16
Abstract:
Redistribution layers for microfeature workpieces, and associated systems and methods are disclosed. One method for processing a microfeature workpiece system includes positioning a pre-formed redistribution layer as a unit proximate to and spaced apart from a microfeature workpiece having an operable microfeature device. The method can further include attaching the redistribution layer to the microfeature workpiece and electrically coupling the redistribution layer to the operable microfeature device.
Public/Granted literature
- US20160118367A1 REDISTRIBUTION LAYERS FOR MICROFEATURE WORKPIECES, AND ASSOCIATED SYSTEMS AND METHODS Public/Granted day:2016-04-28
Information query
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