Invention Grant
- Patent Title: Grounding sleeve
- Patent Title (中): 接地套管
-
Application No.: US14776782Application Date: 2014-03-10
-
Publication No.: US09422066B2Publication Date: 2016-08-23
- Inventor: Carney R. Anderson , John C. Ditomasso
- Applicant: United Technologies Corporation
- Applicant Address: US CT Hartford
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Hartford
- Agency: Kinney & Lange, P.A.
- International Application: PCT/US2014/022724 WO 20140310
- International Announcement: WO2014/150253 WO 20140925
- Main IPC: B64D45/02
- IPC: B64D45/02 ; H02G13/00 ; H01R4/30 ; H01R4/64 ; F16B19/02 ; F16B1/00
Abstract:
A grounding sleeve for grounding an electrically insulated element disposed between two metal components includes an annular body extending between a first end and a second end. At least one window is formed in the annular body between the first end and the second end.
Public/Granted literature
- US20160016673A1 GROUNDING SLEEVE Public/Granted day:2016-01-21
Information query
