发明授权
US09425161B2 Semiconductor device with mechanical lock features between a semiconductor die and a substrate
有权
在半导体管芯和衬底之间具有机械锁定特征的半导体器件
- 专利标题： Semiconductor device with mechanical lock features between a semiconductor die and a substrate
- 专利标题（中）： 在半导体管芯和衬底之间具有机械锁定特征的半导体器件
-
申请号： US14808779申请日： 2015-07-24
-
公开(公告)号： US09425161B2公开(公告)日： 2016-08-23
- 发明人: Lakshminarayan Viswanathan , L. M. Mahalingam , David F. Abdo , Jaynal A. Molla
- 申请人： FREESCALE SEMICONDUCTOR, INC.
- 申请人地址： US TX Austin
- 专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人地址： US TX Austin
- 代理商 Sherry W. Schumm
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L23/00 ; B23K20/02 ; B23K35/02 ; B23K20/24 ; B23K20/16 ; B23K20/10 ; B23K20/00 ; H01L23/31 ; H05K3/28
摘要：
An embodiment of a method of attaching a semiconductor die to a substrate includes placing a bottom surface of the die over a top surface of the substrate with an intervening die attach material. The method further includes contacting a top surface of the semiconductor die and the top surface of the substrate with a conformal structure that includes a non-solid, pressure transmissive material, and applying a pressure to the conformal structure. The pressure is transmitted by the non-solid, pressure transmissive material to the top surface of the semiconductor die. The method further includes, while applying the pressure, exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter. Before placing the die over the substrate, conductive mechanical lock features may be formed on the top surface of the substrate, and/or on the bottom surface of the semiconductor die.
公开/授权文献
信息查询
IPC分类:
