Methods for producing cost effective and reliable antennas and circuits for wireless devices are disclosed. The antennas and circuits are formed by applying a conductive layer to one side of a carrier sheet and attaching a second carrier sheet to encapsulate and protect the conductive layer. The combination of the two carrier sheets and the conductive layer are then formed into one or more three-dimensional antenna structures or circuits in a thermoforming process. This technique enables high volume production of antennas and RF circuits in a fast, reliable, and cost-efficient manner that provides for encapsulation of the conductive layer. The plurality of antennas and circuits formed in this fashion may then be separated by a cutting apparatus to obtain individual devices that are ready for integration into myriad communication devices.