发明授权
- 专利标题： Multi-layer micro-wire structure
- 专利标题（中）： 多层微线结构
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申请号： US14261465申请日： 2014-04-25
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公开(公告)号： US09426885B2公开(公告)日： 2016-08-23
- 发明人: Todd Mathew Spath , Ronald Steven Cok
- 申请人： Todd Mathew Spath , Ronald Steven Cok
- 申请人地址： US NY Rochester
- 专利权人： EASTMAN KODAK COMPANY
- 当前专利权人： EASTMAN KODAK COMPANY
- 当前专利权人地址： US NY Rochester
- 代理商 Raymond L. Owens; Kevin E. Spaulding
- 主分类号： H05K1/09
- IPC分类号： H05K1/09 ; H05K3/24 ; G06F3/044 ; G06F3/041 ; H05K1/18
摘要：
A multi-layer micro-wire structure resistant to cracking including a substrate having a surface, one or more micro-channels formed in the substrate, an electrically conductive first material composition forming a first layer located in each micro-channel, and an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, whereby the multi-layer micro-wire is resistant to cracking.
公开/授权文献
- US20150313008A1 MULTI-LAYER MICRO-WIRE STRUCTURE 公开/授权日：2015-10-29
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