A circuit protection device includes a housing, which includes first and second electrodes. The device includes a conductive slider inside the housing. At a first location within the housing, the slider provides an electrical connection between the first and second electrodes. At a second location within the housing, the slider does not provide the electrical connection. A spring is secured to and stretched between the slider and an inner side of the housing such that the spring is held in tension in an expanded state. The slider is held at the first location by a solder between the slider and the first and second electrodes. After the device is armed, detection of an over-temperature condition causes the solder to begin to melt and the spring to compress and pull the slider to the second location within the housing, thus severing the electrical connection between the first and second electrodes.