Invention Grant
- Patent Title: Integrated circuit devices including contacts and methods of forming the same
- Patent Title (中): 集成电路器件,包括触点及其形成方法
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Application No.: US14628541Application Date: 2015-02-23
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Publication No.: US09431492B2Publication Date: 2016-08-30
- Inventor: Jorge A. Kittl , Dharmendar Reddy Palle , Mark S. Rodder
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sibley, P.A.
- Main IPC: H01L29/45
- IPC: H01L29/45 ; H01L29/417 ; H01L27/088 ; H01L29/78 ; H01L27/12 ; H01L21/768 ; H01L23/485

Abstract:
Integrated circuit devices including contacts and methods of forming the same are provided. The devices may include a fin on a substrate, a gate structure on the fin and a source/drain region in the fin at a side of the gate structure. The devices may further include a contact plug covering an uppermost surface of the source/drain region and a sidewall of the gate structure. The contact plug may include an inner portion including a first material and an outer portion including a second material different from the first material. The outer portion may at least partially cover a sidewall of the inner portion, and a portion of the outer portion may be disposed between the sidewall of the gate structure and the sidewall of the inner portion.
Public/Granted literature
- US20150243747A1 INTEGRATED CIRCUIT DEVICES INCLUDING CONTACTS AND METHODS OF FORMING THE SAME Public/Granted day:2015-08-27
Information query
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