Invention Grant
US09431492B2 Integrated circuit devices including contacts and methods of forming the same 有权
集成电路器件,包括触点及其形成方法

Integrated circuit devices including contacts and methods of forming the same
Abstract:
Integrated circuit devices including contacts and methods of forming the same are provided. The devices may include a fin on a substrate, a gate structure on the fin and a source/drain region in the fin at a side of the gate structure. The devices may further include a contact plug covering an uppermost surface of the source/drain region and a sidewall of the gate structure. The contact plug may include an inner portion including a first material and an outer portion including a second material different from the first material. The outer portion may at least partially cover a sidewall of the inner portion, and a portion of the outer portion may be disposed between the sidewall of the gate structure and the sidewall of the inner portion.
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