Invention Grant
- Patent Title: Package structure for flexible organic light emitting diode device, method for packaging the same and flexible display device
- Patent Title (中): 柔性有机发光二极管器件的封装结构，封装方法和柔性显示器件
-
Application No.: US14415509Application Date: 2014-06-12
-
Publication No.: US09431630B2Publication Date: 2016-08-30
- Inventor: Wei Huang , Weifeng Zhou
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201310407098 20130909
- International Application: PCT/CN2014/079759 WO 20140612
- International Announcement: WO2015/032232 WO 20150312
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/00 ; H01L51/56
Abstract:
According to the present disclosure, there is provided a package structure for a flexible organic light emitting diode (OLED) device, which may include: a flexible substrate, arranged to support the OLED device; a packaging layer, provided on the flexible substrate; the OLED device, provided on the packaging layer; and a waterproof and oxygenproof transparent thin film, covering the OLED device.
Public/Granted literature
Information query
IPC分类:
