Invention Grant
US09433074B2 Printed wiring boards having thermal management features and thermal management apparatuses comprising the same
有权
具有热管理特征的印刷线路板和包括该热管理特征的热管理装置
- Patent Title: Printed wiring boards having thermal management features and thermal management apparatuses comprising the same
- Patent Title (中): 具有热管理特征的印刷线路板和包括该热管理特征的热管理装置
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Application No.: US14038834Application Date: 2013-09-27
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Publication No.: US09433074B2Publication Date: 2016-08-30
- Inventor: Ercan Mehmet Dede , Tsuyoshi Nomura , Paul Schmalenberg , Jae Seung Lee
- Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
- Applicant Address: US KY Erlanger
- Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
- Current Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
- Current Assignee Address: US KY Erlanger
- Agency: Dinsmore & Shohl LLP
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02
Abstract:
A printed wiring board includes an insulator substrate, an electrical conductor at least partially embedded in the insulator substrate, and a thermal conductor at least partially embedded in the insulator substrate. The printed wiring board also includes a temperature-insensitive component mounting region and a temperature-sensitive component mounting region. The insulator substrate and the thermal conductor are arranged into a targeted heat transfer region proximate to the temperature-sensitive component mounting region and a bulk region at positions spaced apart from the temperature-sensitive component mounting region.
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