Invention Grant
- Patent Title: Method of manufacturing master mold
- Patent Title (中): 主模制造方法
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Application No.: US14557712Application Date: 2014-12-02
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Publication No.: US09434093B2Publication Date: 2016-09-06
- Inventor: Sukgyu Hahm , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Sunghoon Lee , Hongseok Lee , Jaeseung Chung
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2014-0053623 20140502
- Main IPC: B29C33/38
- IPC: B29C33/38 ; G03F7/00 ; B29K101/10 ; B29L31/00 ; B29C33/42

Abstract:
A method of manufacturing a master mold includes forming a plurality of replica resin layers using a mold; forming a replica template by bonding the plurality of replica resin layers on a template; forming a replica mold layer having a pattern corresponding to a pattern of the plurality of replica resin layers using the replica template; forming a flexible stamp having a pattern formed on a surface thereof using the replica mold layer; transferring the pattern formed on the surface of the flexible stamp to a mold resin; and forming a large area master mold by etching a surface of a substrate based on a pattern shape of the mold resin.
Public/Granted literature
- US20150314488A1 METHOD OF MANUFACTURING MASTER MOLD Public/Granted day:2015-11-05
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