Invention Grant
- Patent Title: Adhesive composition, an adhesive sheet and a production method of a semiconductor device
- Patent Title (中): 粘合剂组合物，粘合片和半导体装置的制造方法
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Application No.: US13832170Application Date: 2013-03-15
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Publication No.: US09434865B2Publication Date: 2016-09-06
- Inventor: Sayaka Tsuchiyama , Isao Ichikawa
- Applicant: LINTEC Corporation
- Applicant Address: JP Tokyo
- Assignee: LINTEC Corporation
- Current Assignee: LINTEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Cahn & Samuels, LLP
- Priority: JP2012-061097 20120316
- Main IPC: C09J5/00
- IPC: C09J5/00 ; C09J7/02 ; C09J133/08 ; C09J133/10 ; C09J133/12 ; C09J133/14 ; C09J133/24 ; H01L21/78 ; H01L21/58 ; C09J133/00 ; H01L21/683 ; C09J133/06 ; C09J143/04 ; H01L23/00 ; H01L25/00 ; H01L23/29 ; H01L25/065
Abstract:
An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a coupling agent (C) having reactive a double bond group.
Public/Granted literature
- US20130244401A1 Adhesive Composition, An Adhesive Sheet and a Production Method of a Semiconductor Device Public/Granted day:2013-09-19
Information query
