Invention Grant
US09434865B2 Adhesive composition, an adhesive sheet and a production method of a semiconductor device 有权
粘合剂组合物,粘合片和半导体装置的制造方法

Adhesive composition, an adhesive sheet and a production method of a semiconductor device
Abstract:
An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a coupling agent (C) having reactive a double bond group.
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