Invention Grant
- Patent Title: Board connection structure and electronic device
- Patent Title (中): 板连接结构和电子设备
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Application No.: US14808632Application Date: 2015-07-24
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Publication No.: US09436861B2Publication Date: 2016-09-06
- Inventor: Hiromasu Meguro , Satoshi Ogasawara , Jun Uchino , Yasunori Chiba , Youichi Ushigome
- Applicant: CASIO COMPUTER CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2014-173611 20140828
- Main IPC: G06K7/10
- IPC: G06K7/10
Abstract:
A board connection structure including a wiring board having a contact point section provided at one end portion and opposed to a switch button, and a holding member to which the wiring board is attached with flat surfaces of the contact point section and the connection section on the same surface intersecting with each other by the folding of the wiring board.
Public/Granted literature
- US20160064874A1 BOARD CONNECTION STRUCTURE AND ELECTRONIC DEVICE Public/Granted day:2016-03-03
Information query
