Invention Grant
- Patent Title: Soft magnetic exchange-coupled composite structure, and high-frequency device component, antenna module, and magnetoresistive device including the soft magnetic exchange-coupled composite structure
- Patent Title (中): 软磁交换耦合复合结构，高频器件组件，天线模块和磁阻器件，包括软磁交换耦合复合结构
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Application No.: US14146274Application Date: 2014-01-02
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Publication No.: US09437358B2Publication Date: 2016-09-06
- Inventor: Young-min Kang , Kyung-han Ahn , Young-jae Kang , Sang-mock Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0085692 20130719
- Main IPC: H01F1/11
- IPC: H01F1/11 ; H01F10/26 ; C22C29/12 ; H01F1/34 ; H01Q7/06
Abstract:
A soft magnetic exchange-coupled composite structure, and a high-frequency device component, an antenna module, and a magnetoresistive device including the soft magnetic exchange-coupled composite structure, include a ferrite crystal grain as a main phase and a soft magnetic metal thin film bound to the ferrite crystal grain by interfacial bonding on an atomic scale. A region of the soft magnetic metal thin film adjacent to an interface with the ferrite crystal grain includes a crystalline soft magnetic metal.
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