Invention Grant
- Patent Title: Enhanced flip chip structure using copper column interconnect
- Patent Title (中): 使用铜柱互连的增强型倒装芯片结构
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Application No.: US14714331Application Date: 2015-05-17
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Publication No.: US09437534B2Publication Date: 2016-09-06
- Inventor: Thomas Matthew Gregorich , Tzu-Hung Lin , Che-Ya Chou
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00
Abstract:
A flip chip package includes: a carrier coupled to a die. The carrier includes: at least a via, for coupling the surface of the carrier to electrical traces in the carrier; and at least a capture pad electrically coupled to the via, wherein the capture pad is plated over the via. The die includes: at least a bond pad formed on the surface of the die; and at least a copper column, formed on the bond pad for coupling the die to the capture pad on the carrier, wherein part of the copper column overhangs the via opening.
Public/Granted literature
- US20150249060A1 ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT Public/Granted day:2015-09-03
Information query
IPC分类:
