Invention Grant
US09437577B2 Package on package structure with pillar bump pins and related method thereof
有权
具有柱形凸块销的封装结构封装及其相关方法
- Patent Title: Package on package structure with pillar bump pins and related method thereof
- Patent Title (中): 具有柱形凸块销的封装结构封装及其相关方法
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Application No.: US14273553Application Date: 2014-05-09
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Publication No.: US09437577B2Publication Date: 2016-09-06
- Inventor: Wen-Sung Hsu , Shih-Chin Lin
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/065 ; H01L23/00 ; H01L23/495 ; H01L25/00 ; H01L23/498 ; H01L25/10
Abstract:
A package on package (POP) structure includes at least a first package and a second package. The first package has a plurality of pillar bump pins. The second package has a plurality of pads connected to the pillar bump pins, respectively. A method of forming a package on package (POP) structure includes at least the following steps: providing a first package with a plurality of pillar bump pins; providing a second package with a plurality of pads; and forming the POP structure by connecting the pillar bump pins to the pads.
Public/Granted literature
- US20150325549A1 PACKAGE ON PACKAGE STRUCTURE WITH PILLAR BUMP PINS AND RELATED METHOD THEREOF Public/Granted day:2015-11-12
Information query
IPC分类:
