发明授权
- 专利标题： Multi-layer wire structure for high efficiency wireless communication
- 专利标题（中）： 多层线结构，高效无线通信
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申请号： US13233751申请日： 2011-09-15
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公开(公告)号： US09439287B2公开(公告)日： 2016-09-06
- 发明人: Vinit Singh , Christine A. Frysz
- 申请人： Vinit Singh , Christine A. Frysz
- 申请人地址： US IL Chicago
- 专利权人： NuCurrent, Inc.
- 当前专利权人： NuCurrent, Inc.
- 当前专利权人地址： US IL Chicago
- 代理机构： McDermott Will & Emery, LLP
- 主分类号： H05K1/09
- IPC分类号： H05K1/09 ; H05K1/16 ; H05K3/46
摘要：
A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
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