Invention Grant
- Patent Title: Flooring system having assembly clip and related method
- Patent Title (中): 地板系统具有组装夹和相关方法
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Application No.: US14691012Application Date: 2015-04-20
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Publication No.: US09441379B2Publication Date: 2016-09-13
- Inventor: Evan J. Stover , Lee R. Stover
- Applicant: Evan J. Stover , Lee R. Stover
- Agency: Barclay Damon, LLP
- Main IPC: E04F15/02
- IPC: E04F15/02

Abstract:
A flooring system includes a plurality of individual flooring pieces, such as floor panels, each having a wear surface, an opposing mounting surface and a retention groove disposed within the mounting surface. A floor panel connector used to interconnect at least two of the floor panels has a base, at least one mast extending from an upper surface of the base and a pair of flexible arms. Each flexible arm extends transversely from opposing sides of the at least one mast and has an extending end. Contacting portions extending from a lower surface of the base are configured to engage the support surface and create a spacing between each flexible arm and the support surface to permit each flexible arm to elastically deflect toward the support surface when pressure is exerted on a floor panel. This deflection enables the extending end of each flexible arm to engage the retention groove of a corresponding floor panel.
Public/Granted literature
- US20160060880A1 FLOORING SYSTEM HAVING ASSEMBLY CLIP AND RELATED METHOD Public/Granted day:2016-03-03
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