A temperature switch electrically interconnects a first wire and a second wire, and includes a conducting mechanism and a temperature control mechanism controlling electrical connection between the first and second wires using the conducting mechanism in a normal condition. The conducting mechanism includes a safety unit composed of a conducting resilient bracket and a deformable component abutting against the conducting resilient bracket, thereby enabling the conducting resilient bracket to electrically interconnect the first and second wires. The deformable component is deformed upon reaching a specific temperature, such that interconnection between the first and second wires made via the conducting resilient bracket is broken.