Invention Grant
- Patent Title: RF thermal fuse
- Patent Title (中): 射频热熔丝
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Application No.: US13869653Application Date: 2013-04-24
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Publication No.: US09443683B2Publication Date: 2016-09-13
- Inventor: Frantisek Hrnicko , Vaclav Volf , Libor Strachon , Thomas Kummetz , Stefan Eisenwinter , Matthew Thomas Melester , Jürgen Struller , Gabriel Toth
- Applicant: CommScope Technologies LLC
- Applicant Address: US NC Hickory
- Assignee: CommScope Technologies LLC
- Current Assignee: CommScope Technologies LLC
- Current Assignee Address: US NC Hickory
- Agency: Fogg & Powers LLC
- Main IPC: H01H37/52
- IPC: H01H37/52 ; H01H37/36 ; H01H37/46 ; H01H79/00 ; H01H37/76

Abstract:
Certain aspects are directed to a thermal fuse for preventing overheating of RF devices in a telecommunication system. The RF thermal fuse includes a body, a conductive bolt, and a driving mechanism. The body can be positioned on a transmission line between an RF signal source and an RF device. The conductive bolt is positioned in the body. The conductive bolt has a length sufficient to provide impedance at a point of protection on the transmission line in response to the conductive bolt contacting a live conductor of the transmission line. The impedance is sufficient to reflect a portion of the incident power of an RF signal from the RF source. The driving mechanism can cause the conductive bolt to contact the live conductor in response to a temperature at or near the point of protection exceeding a threshold temperature.
Public/Granted literature
- US20130278376A1 RF Thermal Fuse Public/Granted day:2013-10-24
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