Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14834465Application Date: 2015-08-25
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Publication No.: US09443930B2Publication Date: 2016-09-13
- Inventor: Junsoo Kim , Dongjin Lee , Dongsoo Woo , Jun-Bum Lee , Sang-Il Han
- Applicant: Junsoo Kim , Dongjin Lee , Dongsoo Woo , Jun-Bum Lee , Sang-Il Han
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2014-0125090 20140919
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/49 ; H01L29/51 ; H01L27/088 ; H01L27/108 ; H01L27/22 ; H01L27/24

Abstract:
A semiconductor device may include a semiconductor substrate including an active region defined by a trench, a device isolation layer provided in the trench to surround the active region, a gate electrode extending in a direction crossing the active region, and formed on the active region and the device isolation layer, and a gate insulating layer between the active region and the gate electrode. The active region may have a first conductivity type, and the device isolation layer may include a first silicon oxide layer on an inner surface of the first trench and a different layer, selected from one of first metal oxide layer and a negatively-charged layer, on the first silicon oxide layer.
Public/Granted literature
- US20160087035A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2016-03-24
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