发明授权
- 专利标题： Thin-layer encapsulation for an optoelectronic component, method for the production thereof, and optoelectronic component
- 专利标题（中）： 用于光电子部件的薄层封装，其制造方法和光电子部件
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申请号： US13260560申请日： 2010-03-22
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公开(公告)号： US09444062B2公开(公告)日： 2016-09-13
- 发明人: Dirk Becker , Thomas Dobbertin , Erwin Lang , Thilo Reusch
- 申请人： Dirk Becker , Thomas Dobbertin , Erwin Lang , Thilo Reusch
- 申请人地址： DE Regensburg
- 专利权人： OSRAM OLED GmbH
- 当前专利权人： OSRAM OLED GmbH
- 当前专利权人地址： DE Regensburg
- 代理商 Cozen O'Connor
- 优先权： DE102009014543 20090324; DE102009024411 20090609
- 国际申请： PCT/EP2010/053717 WO 20100322
- 国际公布： WO2010/108894 WO 20100930
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L51/44 ; H01L51/52
摘要：
A thin-layer encapsulation (1) for an optoelectronic component. The thin-layer encapsulation (1) comprises a sequence of layers (2) that comprises the following layers: a first ALD layer (3) deposited by means of atomic layer deposition, and a second ALD layer (4) deposited by means of atomic layer deposition. A method is disclosed for producing the thin-layer encapsulation and an optoelectronic component is disclosed having such a thin-layer encapsulation.
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