发明授权
- 专利标题： Chemical mechanical polishing pad with window
- 专利标题（中）： 化学机械抛光垫带窗
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申请号： US14657123申请日： 2015-03-13
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公开(公告)号： US09446498B1公开(公告)日： 2016-09-20
- 发明人: Joseph So , Bainian Qian , Janet Tesfai
- 申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc.
- 申请人地址： US DE Newark
- 专利权人： Rohm and Hass Electronic Materials CMP Holdings, Inc.
- 当前专利权人： Rohm and Hass Electronic Materials CMP Holdings, Inc.
- 当前专利权人地址： US DE Newark
- 代理商 Thomas S. Deibert
- 主分类号： C23F1/00
- IPC分类号： C23F1/00 ; B24B37/20 ; B24B37/013 ; B24B49/12 ; B24B37/005
摘要：
A chemical mechanical polishing pad is provided having a polishing layer; an endpoint detection window; subpad; and, a stack adhesive; wherein the subpad includes plurality of apertures in optical communication with the endpoint detection window; and, wherein the polishing surface of the polishing layer is adapted for polishing of a substrate.
公开/授权文献
- US20160263721A1 CHEMICAL MECHANICAL PLISHING PAD WITH WINDOW 公开/授权日：2016-09-15
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