发明授权
US09446566B2 Laminate, method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object
有权
层压板,层压板的切割方法,层叠体的加工方法,切断脆性板状物体的装置及方法
- 专利标题: Laminate, method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object
- 专利标题(中): 层压板,层压板的切割方法,层叠体的加工方法,切断脆性板状物体的装置及方法
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申请号: US14117127申请日: 2012-05-14
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公开(公告)号: US09446566B2公开(公告)日: 2016-09-20
- 发明人: Yoshiharu Miwa , Yoshinori Hasegawa , Takayuki Noda , Hiroki Mori , Michiharu Eta
- 申请人: Yoshiharu Miwa , Yoshinori Hasegawa , Takayuki Noda , Hiroki Mori , Michiharu Eta
- 申请人地址: JP Shiga
- 专利权人: NIPPON ELECTRIC GLASS CO., LTD.
- 当前专利权人: NIPPON ELECTRIC GLASS CO., LTD.
- 当前专利权人地址: JP Shiga
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2011-108458 20110513; JP2011-247451 20111111; JP2011-252966 20111118
- 国际申请: PCT/JP2012/062304 WO 20120514
- 国际公布: WO2012/157610 WO 20121122
- 主分类号: B32B17/10
- IPC分类号: B32B17/10 ; C03B33/07 ; C03B33/09 ; C03B33/04 ; B28D1/22 ; B23K26/08 ; B32B3/02 ; B32B3/30 ; B32B7/12 ; C03B21/02 ; B23K26/40 ; B29C67/00 ; B32B37/14 ; G02F1/1333
摘要:
Provided is a laminate (1) obtained by integrally laminating glass sheets (4) on both surfaces of a resin sheet (2). The glass sheets (4) have a thickness of 300 μm or less and end surfaces (4a) of the glass sheets (4) are chamfered.