Invention Grant
- Patent Title: Method of lower profile MEMS package with stress isolations
- Patent Title (中): 具有应力分离的低剖面MEMS封装的方法
-
Application No.: US14568845Application Date: 2014-12-12
-
Publication No.: US09446941B2Publication Date: 2016-09-20
- Inventor: Tongbi Jiang , Jie-Hua Zhao , Peter G. Hartwell
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B7/00
Abstract:
MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
Public/Granted literature
- US20160167949A1 METHOD OF LOWER PROFILE MEMS PACKAGE WITH STRESS ISOLATIONS Public/Granted day:2016-06-16
Information query
IPC分类:
