Invention Grant
- Patent Title: Sensor arrangement
- Patent Title (中): 传感器布置
-
Application No.: US14016046Application Date: 2013-08-31
-
Publication No.: US09448130B2Publication Date: 2016-09-20
- Inventor: Mathias Vaupel , Horst Theuss , Thomas Lehmann
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: G01L9/16
- IPC: G01L9/16 ; G01M1/12 ; H01L23/00 ; G01L19/00 ; G01L19/14

Abstract:
A sensor arrangement for sensing an environmental property of an environment of the sensor arrangement, the sensor arrangement comprising: a carrier; an active sensor component arranged at the carrier and configured for providing a sensor signal being indicative of the environmental property; a molding structure encapsulating at least a part of an exterior surface of the carrier and comprising an access recess exposing the active sensor component with regard to the environment; wherein the access recess is arranged asymmetrically with regard to the carrier.
Public/Granted literature
- US20150059454A1 Sensor arrangement Public/Granted day:2015-03-05
Information query