Invention Grant
- Patent Title: Pulse injection apparatus
- Patent Title (中): 脉冲注射装置
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Application No.: US14161416Application Date: 2014-01-22
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Publication No.: US09448270B2Publication Date: 2016-09-20
- Inventor: Up Namkoong , Seung-Kab Ryu , Uijung Kim , Kwang-Uk Chu
- Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Agency: LRK Patent Law Firm
- Priority: KR10-2013-0074673 20130627
- Main IPC: H01R24/42
- IPC: H01R24/42 ; G01R31/02 ; H01R24/54 ; G01R31/00

Abstract:
A coupling clamp-type pulse injection apparatus, which can couple a high-voltage wideband pulse having a peak voltage of several tens of kV and having a rising time of several hundreds of ps or less to a cable without causing dielectric breakdown and a 50 ohm impedance mismatch, is provided. The pulse injection apparatus includes an input connector, an output connector, and a main body including an inner plate connected at a first end thereof to the input connector and at a second end thereof to the output connector, and a coupling plate connected to the inner plate and configured to fix a cable to the inner plate and to couple a high-power electromagnetic pulse input through the input connector to the cable.
Public/Granted literature
- US20150004847A1 PULSE INJECTION APPARATUS Public/Granted day:2015-01-01
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