An electroconductive material for a connection component have a base member made of a copper alloy plate, a Ni coating layer, a Cu—Sn alloy coating layer, and a Sn coating layer. A surface of the material is subjected to reflow treatment. The base member surface is roughened. The Cu—Sn alloy coating layer is partially exposed from the outside surface of the Sn coating layer. Regions of the Cu—Sn alloy coating layer exposed to the outside surface of the Sn coating layer have random microstructures distributed irregularly between portions of the Sn coating layer and streak microstructures extending in parallel to a rolled direction of the base member. The streak microstructures having a length of 50 μm or more and a width of 10 μm or less are contained in a number of 35 or more per 1 mm2.