Invention Grant
- Patent Title: Molded article of polyolefin-based resin expanded beads
- Patent Title (中): 聚烯烃类树脂膨胀珠的成型制品
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Application No.: US14047584Application Date: 2013-10-07
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Publication No.: US09449735B2Publication Date: 2016-09-20
- Inventor: Takuya Chiba , Masaharu Oikawa , Mitsuru Shinohara
- Applicant: JSP CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSP CORPORATION
- Current Assignee: JSP CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Bacon & Thomas, PLLC
- Priority: JP2012-225005 20121010
- Main IPC: H01B1/06
- IPC: H01B1/06 ; H01B1/24 ; C08J9/00 ; C08J9/12 ; C08J9/18 ; C08J9/232 ; C08J9/34

Abstract:
An electrostatic dissipating molded article having a surface resistivity of 1×105 to 1×1010Ω and obtained by in-mold molding of multi-layered polyolefin-based resin expanded beads each having an polyolefin-based resin expanded core layer and a polyolefin-based resin cover layer which covers the polyolefin-based resin expanded core layer and which is formed from a polyolefin-based resin (A), a polymeric antistatic agent (B) of a block copolymer of a polyether block and a polyolefin block, and an electrically conductive carbon black (C), the components (A) to (C) being present in a specific proportion.
Public/Granted literature
- US20140097389A1 MOLDED ARTICLE OF POLYOLEFIN-BASED RESIN EXPANDED BEADS Public/Granted day:2014-04-10
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