Invention Grant
- Patent Title: Varying thickness inductor
- Patent Title (中): 不同厚度的电感
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Application No.: US14155244Application Date: 2014-01-14
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Publication No.: US09449753B2Publication Date: 2016-09-20
- Inventor: Daeik Daniel Kim , Chengjie Zuo , Changhan Hobie Yun , Mario Francisco Velez , Robert Paul Mikulka , Xiangdong Zhang , Jonghae Kim , Je-Hsiung Lan
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Incorporated
- Current Assignee: Qualcomm Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Toler Law Group, PC
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/29 ; H01F27/30 ; H01F27/28 ; H01F41/04 ; H01F17/00

Abstract:
A particular device includes a substrate and a spiral inductor coupled to the substrate. The spiral inductor includes a first conductive spiral and a second conductive spiral overlaying the first conductive spiral. A first portion of an innermost turn of the spiral inductor has a first thickness in a direction perpendicular to the substrate. The first portion of the innermost turn includes a first portion of the first conductive spiral and does not include the second conductive spiral. A second portion of the innermost turn includes a first portion of the second conductive spiral. A portion of an outermost turn of the spiral inductor has a second thickness in the direction perpendicular to the substrate that is greater than the first thickness. A portion of the outermost turn includes a second portion of the first conductive spiral and a second portion of the second conductive spiral.
Public/Granted literature
- US20150061813A1 VARYING THICKNESS INDUCTOR Public/Granted day:2015-03-05
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