Invention Grant
US09449902B2 Semiconductor packages having multiple lead frames and methods of formation thereof
有权
具有多个引线框架的半导体封装及其形成方法
- Patent Title: Semiconductor packages having multiple lead frames and methods of formation thereof
- Patent Title (中): 具有多个引线框架的半导体封装及其形成方法
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Application No.: US14535138Application Date: 2014-11-06
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Publication No.: US09449902B2Publication Date: 2016-09-20
- Inventor: Ralf Otremba , Josef Hoeglauer , Juergen Schredl , Xaver Schloegel , Klaus Schiess
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L23/495 ; H01L23/31 ; H01L23/00 ; H01L29/20 ; H01L29/78
Abstract:
In accordance with an embodiment of the present invention, a semiconductor package includes a first lead frame having a first die paddle, and a second lead frame, which has a second die paddle and a plurality of leads. The second die paddle is disposed over the first die paddle. A semiconductor chip is disposed over the second die paddle. The semiconductor chip has a plurality of contact regions on a first side facing the second lead frame. The plurality of contact regions is coupled to the plurality of leads.
Public/Granted literature
- US20150060878A1 Semiconductor Packages Having Multiple Lead Frames and Methods of Formation Thereof Public/Granted day:2015-03-05
Information query
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