Invention Grant
US09449978B2 Semiconductor devices including a recessed access device and methods of forming same
有权
包括凹入式存取装置的半导体装置及其形成方法
- Patent Title: Semiconductor devices including a recessed access device and methods of forming same
- Patent Title (中): 包括凹入式存取装置的半导体装置及其形成方法
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Application No.: US14148402Application Date: 2014-01-06
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Publication No.: US09449978B2Publication Date: 2016-09-20
- Inventor: Kamal M. Karda , Mingtao Li , Haitao Liu , Deepak Chandra Pandey , Mark Fischer
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L27/105 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device comprises a recessed access device that includes a first pillar, a second pillar, a channel region connecting the first and second pillars, and a gate disposed over the channel region. The channel region has a width that is narrower than widths of the first pillar and the second pillar. An array of recessed access devices comprises a plurality of pillars protruding from a substrate, and a plurality of channel regions. Each channel region has a width that is less than about 10 nm and couples neighboring pillars to form a plurality of junctionless recessed access devices. A method of forming at least one recessed access device also comprises forming pillars over a substrate, forming at least a channel region coupled with the pillars, the channel region having a relatively narrow width, and forming a gate at least partially surrounding the channel region on at least three sides.
Public/Granted literature
- US20150194430A1 SEMICONDUCTOR DEVICES INCLUDING A RECESSED ACCESS DEVICE AND METHODS OF FORMING SAME Public/Granted day:2015-07-09
Information query
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