An array printed circuit board (PCB) is provided in which a defective single PCB may be easily replaced. A method of replacing a defective single PCB and a method of manufacturing an electronic apparatus are also provided. The array PCB may include a plurality of single PCBs. A rail portion may surround the single PCBs. A plurality of tab route portions connect the single PCBs to the rail portion, each of the tab route portions including at least one pair of via electrodes. A test terminal portion may be formed at one side of the rail portion and may include a plurality of test terminals. The at least one pair of via electrodes may include a first via electrode, arranged adjacent to the rail portion and electrically connected to a corresponding test terminal, and a second via electrode arranged adjacent to and electrically connected to a corresponding single PCB.