Invention Grant
- Patent Title: Heat activated pressure sensitive adhesive
- Patent Title (中): 热活化压敏胶
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Application No.: US14649744Application Date: 2013-12-02
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Publication No.: US09453148B2Publication Date: 2016-09-27
- Inventor: Melinda L. Einsla , William B. Griffith, Jr. , Daniel W. Himmelberger , Melissa Lane , David L. Malotky
- Applicant: Rohm and Haas Company , Dow Global Technologies LLC
- Applicant Address: US MI Midland US PA Philadelphia
- Assignee: Dow Global Technologies LLC,Rohm and Haas Company
- Current Assignee: Dow Global Technologies LLC,Rohm and Haas Company
- Current Assignee Address: US MI Midland US PA Philadelphia
- Agent Kenneth Crimaldi
- International Application: PCT/US2013/072570 WO 20131202
- International Announcement: WO2014/093043 WO 20140619
- Main IPC: C09J153/02
- IPC: C09J153/02 ; C09J7/02 ; C09J109/06

Abstract:
A composition having three components. The first component is from 20 to 80 wt % of a styrene-diene block copolymer having from 10-30 wt % polymerized units of styrene, wherein the block copolymer is present as a dispersion of copolymer in water, and the dispersion contains less than 5 wt % organic solvent based on total dispersion weight. The second component is from 0.5 to 20 wt % of a plasticizer. The third component is from 20 to 80 wt % of a tackifier.
Public/Granted literature
- US20150368521A1 HEAT ACTIVATED PRESSURE SENSITIVE ADHESIVE Public/Granted day:2015-12-24
Information query
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