Invention Grant
US09454188B2 Electronic device structures joined using shrinking and expanding attachment structures
有权
使用收缩和扩展的附接结构连接的电子装置结构
- Patent Title: Electronic device structures joined using shrinking and expanding attachment structures
- Patent Title (中): 使用收缩和扩展的附接结构连接的电子装置结构
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Application No.: US14295051Application Date: 2014-06-03
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Publication No.: US09454188B2Publication Date: 2016-09-27
- Inventor: Tyler S. Bushnell , Jason C. Sauers
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group, P.C.
- Agent G. Victor Treyz; Joseph F. Guihan
- Main IPC: H01R4/72
- IPC: H01R4/72 ; G06F1/18
Abstract:
An electronic device has structures that are assembled using attachment structures. The attachment structures change shape to help join the electronic device structures together. Structures that may be joined together can include electronic device housing structures, display structures, internal device components, electrical components, and other portions of an electronic device. The attachment structures can include heat-activated attachment structures, structures that are activated using other types of applied energy, and structures that change shape due the application of chemicals or other treatments.
Public/Granted literature
- US20150346782A1 Electronic Device Structures Joined Using Shrinking and Expanding Attachment Structures Public/Granted day:2015-12-03
Information query
