Invention Grant
- Patent Title: Wiring structure of head suspension having a stacked interleaved part and method of manufacturing the same
- Patent Title (中): 具有层叠交错部分的头部悬挂的接线结构及其制造方法
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Application No.: US13660477Application Date: 2012-10-25
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Publication No.: US09454982B2Publication Date: 2016-09-27
- Inventor: Hajime Arai
- Applicant: NHK SPRING CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: NHK Spring Co., Ltd.
- Current Assignee: NHK Spring Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Norris McLaughlin & Marcus, P.A.
- Priority: JP2011-241693 20111102
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/05 ; H05K1/18 ; G11B5/48

Abstract:
A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, comprises write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities. The wiring structure further comprises a stacked interleaved part includes segments electrically connected to the respective wires of the write wiring, the segments stacked on and facing the wires through an electrical insulating layer so that the facing wire and segment have opposite polarities.
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